Surface Mount International Conference Proceedings


THE EXPANDING BGA MENU Comparison and Direction of the Exploding Technology

Author: Paul Mescher
Company: Arnkor Electronics
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Over the past 5 years, BGA packages have gone from being an interesting idea to an industry mainstay. With this wide acceptance has come a proliferation of package options, each with specific highlights and hazards. The majority of BGA offerings (new and old) are in the organic area, but ceramic substrates still hold specific markets closely. Within the umbrella of “organic BGA’ is a menu with incomparable diversity. It is becoming obvious that BGA is not just one, or even a few package types, but is a class of packages, in the same way “leaded packages” is a class encompassing many different form factors. Some estimates suggest that by 2005, the BGA class could represent 40% of the packaging dollars spent worldwide. But what shapes will these BGA’s have? A comprehensive review of the current organic BGA designs and directions will be offered, with focus on comparison of the various performance features and design limitations. By examining the strengths and weaknesses of the technology choices, it should be easier to define which BGA types will be the best tit for various industries and what specific enabling technologies will be required to handle the next generation of advanced silicon.



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