Surface Mount International Conference Proceedings


Author: David Mendez
Company: Solectron Texas Engineering
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: As packaging is driven to finer and finer lead pitches, previously inconsequential factors such as the positional accuracy of printed wiring board pads and stencil apertures are now significant root causes of production defects. Preliminary data collected and reported by Solectron Texas Engineering highlighted the concern and prompted further investigation under the National Center for Manufacturing Sciences (NCMS) Surface Mounted Technology Six Sigma program. This study uses data collected by Solectron Texas Engineering and the Manufacturing Process Technology group at Hamilton Standard. The measurements were performed at Solectron Austin, Texas facility. Hamilton Standard performed the detail analysis and constructed the statistical model. The benefits of the statistical model are that it:  Quantifies the problem  Suggests areas where the most efficient improvement will be gained  Provides a tool to design organizations for laying out printed wiring board designs  Predicts the degree of difficulty (Cp) the production area will encounter during fabrication  Identities where new technology can be used to improve yield

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819