2011 iNEMI Technology Roadmap and Its Place in Fulfilling the iNEMI Mission
Authors: Bill Bader and Chuck Richardson Company: International Electronics Manufacturing Initiative (iNEMI) Date Published: 2/14/2012
Pan Pacific Symposium
Abstract: iNEMI released its 2011 Technology Roadmap to industry on March 29, 2011. Every two years iNEMI maps future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and markets, technology gaps, and identified needs in each of 6 product segments: aerospace/defense, automotive, consumer/portable, medical, netcom, and office/large business systems as well as forecasting the technical evolution associated with 21 different areas that support these product area needs. The resulting gaps identified between the product needs and technical capabilities form the basis for iNEMI projects and potential research programs within and outside iNEMI. This paper discusses the iNEMI roadmap process and highlights 1 product and 2 technology areas: Medical Products, Interconnect PCB (organic), and Packaging Technologies and demonstrates with an example how the roadmap fulfills an important function of the overall iNEMI mission – identifying technical and business gaps and showstoppers and promoting workshops, projects and research to address and solve them.