Pan Pacific Symposium Conference Proceedings


JISSO Electronics Technology Roadmap Through 2020

Author: Henry H. Utsunomiya
Company: Interconnection Technologies, Inc.
Date Published: 2/14/2012   Conference: Pan Pacific Symposium


Abstract: Jisso (Assembly & Packaging, Mounting, Interconnecting in Japanese) technology roadmap have bee publishing every two years since 1999 to enhance Japanese electronics industry’s competitiveness. Features of Jisso technology roadmap are addressed electronics products requirements or demands toward next decade and supply chain technology capabilities trends such as packaging, electronic components, printed wiring boards, packaging substrate and mounting machines.

In the 2011 edition, the electronic products are scoped of automotive electronics such as ECUs, car navigation systems, home digital AV equipment, notebook PCs, cellular phones, Digital Video Camcorders (DVC), Digital Still Cameras (DSC), and wearable personal audio electronics.`

Key Words: 

BAN (Body Area Network), CoC (Chip-on-Chip), EAD (Embedded Active Device), ECU (Electronic Control Unit), EMS (Electronic Manufacturing Service), EPD (Embedded Passive Device), FBGA, Large Area Flexible Electronics, Optical Wave Guide Line, P-BGA, PoP (Package-on-Package), PWB (Printed Wiring Board), SMD (Surface Mount Device), TSV, WL-CSP



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