Pan Pacific Symposium Conference Proceedings


The IPC International Technology Roadmap For Electronic Interconnections

Author: Dieter W. Bergman
Company: IPC Inc.
Date Published: 2/14/2012   Conference: Pan Pacific Symposium


Abstract: The electronic interconnection supply chain consists of three basic links: 1) the fabrication of semiconductors and their associated packaging; 2) the fabrication of the interconnecting substrate for both the semiconductor package and the product printed board; and 3) the assembly and test. Today, many of these functions are accomplished in a variety of partnerships. The shift in the business model, developed through outsourcing many of the activities, requires that the links between the three elements are strengthened through clear and unambiguous communication. It is also important that each player in the supply chain understands their contribution to the product reliability.

In many cases, the EMS provider helps in the design function. Using the tools at their disposal, they are responsible for the documentation and for procuring component parts as well as printed boards. As the agent of the OEM, the EMS provider also faces the challenges of requirements to meet new legal directives to remove hazardous substances from the electronic products, implement more robust processes and face greater density packaged in smaller form factors. Another supply chain challenge, directed toward the printed board manufacturing, is keeping up with the integration scale of silicon. The circuit board now contributes to the electrical function; thus, changes in material and mounting structure can dramatically change the electrical performance of the final product.

An area where consortia, made up of users and suppliers, have been very successful is in the area of hazardous material properties. Since the EU and other country Directives have identified a group of materials that are restricted from the electronic product market, companies have banded together to look for alternatives. These issues have become a global problem, even for companies that have no intention of placing their product in any of the restricted market areas. Component suppliers have already changed termination finishes from the traditional tin-lead to new alloys that do not contain lead in excess of the permitted allowance. Therefore many of the assembly processes have been reviewed and revised to handle the attachment requirements for the new finishes. Nevertheless, there are still product markets that have yet to embrace the idea of using lead-free solders, due mainly to lack of reliability data.

The IPC roadmap identifies some of the difficulties members of the supply chain are facing as well as the research needed. A great deal of focus is placed on the timing necessary to meet the new global hazardous material elimination directives as well as the sustainability of the product over its life cycle. Since companies are dealing with regulations in several different markets, it has become paramount to be aware of the different requirements in each global sector and the manner in which the supply chain must be prepared to provide documentation indicating compliance. The energy and focus of technology drivers has been to define, educate and recommend how to meet these regulatory requirements.

Key Words: 

electronic interconnection, supply chain, roadmap



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