Pan Pacific Symposium Conference Proceedings

Technology Alternatives Towards Low-Cost and High-Speed Interconnect Manufacturing

Authors: F. Roozebooma, B. Kniknie, A.M. Lankhorst, G. Winands, R. Knaapen, P. Poodt, G. Dingemans, W. Keuning, W.M.M. Kessels, J.E. Bullema, P.M.M.C. Bressers, G. Oosterhuis, M. Mueller and A.J. Huis in't Veld
Company: TNO, Eindhoven University of Technology, Advanced Laser Separation International, and University of Twente
Date Published: 2/14/2012   Conference: Pan Pacific Symposium

Abstract: In this work we will review our recent work on novel alternative and disruptive technology concepts with industrial potential for cost-effective and high-speed interconnect manufacturing, in particular on the creation (drilling and filling) of advanced interconnects like TSVs. These technologies are 1) Spatially-divided Deep Reactive Ion Etching, S-DRIE, 2) Electrochemical Micromachining, ECM, and 3) Laser-Induced Forward Transfer, LIFT. The first technique will be reviewed in detail, the other two will only shortly be described.

Key Words: 

TSV, Spatially-divided Deep Reactive Ion Etching, ALD Oxide Passivation, Electrochemical Micro-machining, Laser-Induced Forward Transfer

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