Equipment and Process Solutions for Low Cost High Volume Manufacturing Of 3D Integrated DevicesAuthors: Markus Wimplinger, Jürgen Burggraf, Daniel Burgstaller, Thorsten Matthias, Harald Wiesbauer, Andreas Fehkührer, and Maria Schachinger
Company: EV Group
Date Published: 2/14/2012 Conference: Pan Pacific Symposium
This paper introduces a novel metrology solution capable of detecting all quality relevant parameters of temporarily bonded stacks in a single measurement cycle using an Infrared (IR) based measurement principle. Thanks to the IR based measurement principle, the metrology solution is compatible with both silicon and glass carriers. The system design has been developed with the inline metrology task in mind. This has lead to a unique system design concept that enables scanning of wafers at a throughput rate sufficient to enable 100% inspection of all bonded wafers inline in the Temporary Bonding system. Both, current generation temporary bonding system throughputs and future high volume production system throughputs as required by the industry for cost effective manufacturing of 3D stacked devices were taken into account as basic specifications for the newly developed metrology solution. Sophisticated software algorithms allow for making pass/ fail decisions for the bonded stacks and triggering further inspection, processing and / or re-work. Actual metrology results achieved with this novel system will be presented and discussed. In terms of adhesive total thickness variation (TTV) of bonded wafers, currently achieved performance values for post-bond TTV will be reviewed in light of roadmaps as required by high volume production customers.
Furthermore, the paper will review a suggested product flow considering inline metrology as well as additional offline inspection processes for making a final pass / fail decision.
temporary bonding, debonding, inline metrology, adhesive TTV, thin wafer TTV, carrier wafer TTV, bonding voids
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