Surface Mount International Conference Proceedings


HIGH FREQUENCY BGAs FOR CELLULAR PHONE AND WIRELESS APPLICATIONS

Author: Carmen Mattei
Company: Abpac
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: This paper describes a family of low lead count Ball Grid Array (BGA) packages designed specifically to address Transmit/Receive (T/R) ICS used in cellular phone and other wireless communication products. T/R ICS fabricated from silicon or GaAs are required fm any product that communicates via airwaves. A high volume manufacturing process is described and data is presented that demonstrates high frequency operation and fusibility up to 6.0 GHz. Keywords: RFBGA, High Frequent Wireless Cellular



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