Pan Pacific Symposium Conference Proceedings


Towards Large Area Roll-To-Roll (R2R) Flexible Multilayer Electronics

Authors: Denisse E. Yepez, M.S.; Daryl L. Santos, Ph.D.; Bahgat Sammakia, Ph.D.; and Mark D. Poliks, Ph.D.
Company: Binghamton University and Endicott Interconnect Technologies, Inc.
Date Published: 2/14/2012   Conference: Pan Pacific Symposium


Abstract: Integrated circuits (ICs) are constantly shrinking in order to incorporate more functionality within a device. The goal in today’s (and tomorrow’s) technology is not only miniaturization of electronic devices – but also to manufacture devices that are flexible and in a large area array – as is the goal that Roll-to-Roll (R2R) is meant to enable. R2R offers the potential to create large area, conformably shaped, lightweight and non-breakable flexible electronics.

Essentially, this research will provide some of the first parameter settings for a photolithography tool and the first steps into achieving the development of devices. The purpose of this research is to demonstrate the preliminary overlay data from the photolithography equipment in R2R format of two flexible substrates. These two substrates are polyethylene therephthalete (PET) and polyimide (PI). Hence, this paper explores the overlay components calculated for photolithography using two flexible substrate materials. The techniques applied for the comparison of both substrate types are descriptive statistics and run-charts of the overlay data components. The techniques will demonstrate the behavioral trends between both substrates.

Key Words: 

flexible electronics, roll-to-roll, PET, PI, integrated circuits



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