Surface Mount International Conference Proceedings


THE EFFECT OF SUBSTRATE THICKNESS ON CBGA FATIGUE LIFE

Author: Gregory B. Martin
Company: IBM Microelectronics
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Substrate thickness has been found to dramatically affect the fatigue life of ceramic ball grid arrays (CBGA). In addition to the experimental verification of this effect, a thermo-mechanical model is presented to explain the phenomena and to aid in optimizing substrate and card designs to maximize the potential of CBGA’S.



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