Pan Pacific Symposium Conference Proceedings


Tin-Copper-Nickel-Germanium - A Case Study in Lead-Free Implementation

Author: Tetsuro Nishimura
Company: Nihon Superior Co., Ltd.
Date Published: 2/14/2012   Conference: Pan Pacific Symposium


Abstract: Although reservations about lead-free implementation remain, the reality is that it is now generally accepted as the default technology for the electronics industry into the future. But only five years on from the implementation of the EU RoHS Directive some of the challenges involved in identifying and proving the alloys that could be used as lead-free solders that made the implementation possible are already being forgotten. In the paper the author reports on the development of an alloy that has found wide spread use in wave soldering and as a hot air solder levelled printed circuit board finish as an example of how the some challenges in the years leading up to the change were faced and overcome.

Key Words: 

Lead-free solder, tin-copper-nickel- germanium



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819