Pushing the Limits of Lead-Free SolderingAuthor: Tetsuro Nishimura
Company: Nihon Superior Co., Ltd.
Date Published: 2/14/2012 Conference: Pan Pacific Symposium
While it is not appropriate to make comparisons with assembly technologies based around tin-lead solder it has to be acknowledged that lead-free implementation has created a mood of uncertainty as we move out of the "comfort zone" of established knowhow. That uncertainty is understandable as we consider how lead-free materials are going to behave as joints in semiconductor packages get smaller and conditions in terms of current densities and temperatures get more severe. In this presentation I hope that by sharing my experience with you I will be able to give you more confidence that lead-free technologies can successfully deliver the productivity and reliability the industry requires.
While the conversion of the electronics manufacturing to lead-free technologies seems to many to be a forbidding challenge we can be encouraged by the fact that much of what we have learned from our experience of lead-containing technologies in the past can provide a basis for dealing with the implementation of lead-free technologies in the future.
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