LOCAL BGA QUICK TURNS: ENABLING THERE-MARRIAGE OF FAB, ASSEMBLY& TEST
Author: Robert C. Marrs Company: Abpac Date Published: 4/28/1997
Surface Mount International
Abstract: This paper describes the evolution of assembly logistics and the future business models for cost of ownership and operation of advanced IC manufacturing and distribution. The paper discusses the optimum method far minimizing the total capital cost and resources as well as time to market. The key enabling factors of 13GAs are discussed as well as the economic benefits of combining BGA assembly with waferfab, wafersort, and final test. KEYWORDS BGA, Cost of Ownership, Domestic Assembly, Factory Automotive Packaging Evolution, iUi2rk43Trendr, and US. Competitiveness.