IWLPC (Wafer-Level Packaging) Conference Proceedings


Board Level Reliability Of Wafer Level CSPs For Telecommunication System Applications

Authors: Ding Li, Xiangyong Qing, Lei Feng, Zhenkai Qin, Yuming Ye, and Weifeng Liu, Ph.D.
Company: Huawei Technologies Co.
Date Published: 10/3/2011   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The ever insatiable demand for lighter and smaller consumer devices has driven down the size of the electronic packages. Wafer level chip scale packages (WLPs) have attracted much attention and have seen widespread use in the consumer electronics industry. Similar to the track of memory devices, system OEMs are facing the same situation of having to use WLPs in their products. Concerns arise regarding assembly and board level reliability of WLPs in telecommunication systems with large and thick printed circuit boards, harsh application conditions and long life-cycle expectation. Assembly and reliability of WLPs must be fully evaluated before its use. This paper presents the latest results on assembly and reliability evaluation of WLPs for telecommunication system applications

Key Words: 

WLP, CSP, Solder Joint, Reliability.



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