IWLPC (Wafer-Level Packaging) Conference Proceedings

Design Concept And Processing Solution For Molded Via BGA

Authors: Paul T. Lin and Michael B. McShane
Company: ViaPak LLC
Date Published: 10/3/2011   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Molded Via BGA is a low cost Package-on-Package (PoP) 3D structure that can provide flexible integration of various SMT components to achieve improved performance and reduced package size using conventional and existed assembly equipments and technologies. A concept of using deformable soldering via contacts (DSVC) will be introduced to prevent mold flush surrounding via holes and to guarantee good soldering via connections. DSVC is an example of design for manufacturability and built-in quality. In order to provide good routing connections and increase the flexibilities of stacking components, the application of using PCB interposer will be described. By stacking a customized PCB interposer on top of molded via BGAs, one can integrate any standard surface mounted components, active as well as passive, into the PoP structure. The PCB interposer approach will greatly enhanced the scope of applications and eliminate of requirement of stacking dedicated parts. When one molds the via BGA body, standoffs can also be molded at the same time. By placing properly sized standoffs between the components or interposer, the solder joints of the stacking connections will not collapse, This is very important to stacking structure with heavy heat spreader or components subjected to multiple reflow cycles during the manufacturing or repair processes. Essentially the molded via BGA is a design to provide top side contacts of regular BGAs. Even when the molded via BGA is being used as a single component without any stacking, it will provide on board testing or on board programming capabilities. Key words: Package-on-Package (PoP), Molded Via BGAs, Standoffs for 3D packaging integration, PCB interposer to support PoP, Deformable soldering via contacts (DSVC)

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