A PBGA PACKAGE FOR A HIGH PERFORMANCE MICROPROCESSOR
Author: Dev Malladi Company: Sun Micro Systems Date Published: 4/28/1997
Surface Mount International
Abstract: This paper describes the design and reliability evaluations of a 520 pin Plastic Ball Grid Array (PBGA) package for Microprocessor. The PBGA substrate package was developed to handle chip operation above 200 MHz and the assembly materials were chosen to handle 36 watts of power with the assistance of an integral heat sink and airflow. Component and board level reliability stresses and results were described. The substrate enhancements required to meet the reliability goals were presented.