IWLPC (Wafer-Level Packaging) Conference Proceedings


New Applicationsfor Fan-Out Wafer Level Packaging Technology

Author: José Campos
Company: NANIUM, S.A.
Date Published: 10/3/2011   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The fan-out Wafer Level Package Technology (FO-WLP) eWLB (Embedded Wafer Level Ball Grid Array) is a recent Advanced Packaging technology that was initially developed by Infineon Technologies with reconstituted 8” wafers, and has ramped-up to high volume production since 2009. In a joint development project between Infineon Technologies and NANIUM in 2010, this packaging technology was successfully extended to reconstituted 300mm (12”) wafers for high volume production. NANIUM is producing now under license of IMC (Intel Mobile Communications), the former Wireless Solutions Business Unit of Infineon Technologies. This step enabled a cost advantage position for eWLB compared to other packaging technologies. eWLB is gaining wider market acceptance, but has been restricted up to now to wireless applications leveraged by its advantages regarding performance, form factor and cost. Deploying its innumerous additional advantages, like design and integration flexibilities; thermal and electrical performance; reliability and robustness, NANIUM has started recent R&D projects with different customers with joint goals to enable eWLB on other applications to enter new markets. Some of those projects reached already the milestone “Engineering Samples available”. The paper will present an overview of those new applications, where NANIUM sees eWLB gaining momentum.

Key Words: 

Fan-Out Wafer Level Package; FO-WLP; WLP; eWLB; SiP.



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