Thin Heat Spreader Attach Process For Thermally Constrained Embedded Markets
Authors: Shawn Lloyd, Mike Kochanowski, Satyajit Walwadkar, and Erich Ewy Company: Intel Corporation Date Published: 10/16/2011
Abstract: Many embedded thermal environments are characterized by high ambient temperatures and fan-less operation. To meet thermal requirements, enhancing package thermal performance by adding an integrated heat spreader (IHS) was the first option examined. However, not all components in a product family require the additional thermal management. So adding an IHS to all components in a product family (thus increasing cost) versus only where needed is not a cost effective solution. To address thermal dissipation needs, maintain sku flexibility, and provide cost effective/reliable solution, a division and technology development working group has developed a process for customers to install a thin heat spreader (THS) onto the BGA using conventional surface mount (SMT) equipment and off-the-shelf adhesive thermal interface material (aTIM). This paper will address all aspects of designing and adding a THS in a constrained system environment. The paper will also address developing the manufacturing process & testing to provide a solution that customers can apply to product designs.