SMTA International Conference Proceedings

The Relevance Of Long-Duration TLP Stress On System Level ESD Design

Authors: Gianluca Boselli, Akram Salman, Jonathan Brodsky, and Hans Kunz
Company: Analog Technology Development ESD Lab, Texas Instruments Inc.
Date Published: 10/16/2011   Conference: SMTA International

Abstract: An analysis of long-duration TLP stress will be performed on ESD clamps representative of the most commonly used ESD protection strategies. It will be shown that snapback-based High Voltage devices feature static filamentary conduction after triggering. This leads to failure for TLP pulse widths in excess of 100ns, well below the expected power scaling levels. The need for long TLP testing to establish ESD protection robustness in the system level stress regime will be demonstrated.

Key Words: 

Electrostatic Discharge (ESD), ESD System-Level Design, IEC 61000-4-2, ISO10605, Filamentary conduction

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