Surface Mount International Conference Proceedings


Author: Rob Lyn
Company: Celestica
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: The trend towards increasing I/O in IC packaging has led to the recent growth in development of flip chip modules for single chip and multichip packaging. Several packaging trends are evident such as the shift from peripheral to area array for die and package I/0, and the emergence of lower mat high density organic chip carriers to replace ceramic, thin film and lead/frame substrate technology, The development of organic based flip chip modules represent an excellent vehicle to advance the industry infrastructure for flip chip in terms of increasing the availability of low cost materials and assembly processes.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819