Surface Mount International Conference Proceedings


DESIGN ISSUES FOR FLIP CHIP MODULES

Author: Rob Lyn
Company: Celestica
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: The trend towards increasing I/O in IC packaging has led to the recent growth in development of flip chip modules for single chip and multichip packaging. Several packaging trends are evident such as the shift from peripheral to area array for die and package I/0, and the emergence of lower mat high density organic chip carriers to replace ceramic, thin film and lead/frame substrate technology, The development of organic based flip chip modules represent an excellent vehicle to advance the industry infrastructure for flip chip in terms of increasing the availability of low cost materials and assembly processes.



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