An Innovative Process Indicator For Oxidation Of PCB With OSP Surface Finish (Part 2: Time To Discoloration Correlation With Solderability)Authors: Eric Hou, DF Chung, and Paul Wang, PhD.
Company: Mitac Computer Shunde Ltd.
Date Published: 10/16/2011 Conference: SMTA International
hole fillet, OSP, PCB, lead-free, Silver Nitric AgNO3, Organic Solderability Preservative (OSP);surface finish, lead-free soldering, process indicator
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