NASA/DoD Lead-Free Electronics Project: -20°C To +80°C Thermal Cycle Test
Authors: Thomas A. Woodrow, Ph.D. Company: Boeing Research and Technology Date Published: 10/16/2011
Abstract: Thermal cycle testing was conducted by Boeing Research & Technology (Seattle) for the NASA/DoD Lead-Free Electronics Project. The NASA/DoD Project is testing the reliability of lead-free solder joints against the requirements of the aerospace/military community and is building on the prior work done by the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Lead-Free Solder Project. Test vehicles were assembled using lead-free and SnPb solders and a variety of component types and the test vehicles were then thermally cycled from -20°C to +80°C. At the time that this paper was written, 11,676 thermal cycles had been accumulated. The solder joints on the components were electrically monitored using event detectors and any solder joint failures were recorded on a Labview-based data collection system. The failures of a given component type attached with SnPb solder were compared to the failures of the same component type attached with lead-free solders by using Weibull analysis.