Surface Mount International Conference Proceedings


HIGH VOLUME ASSEMBLY OF CERAMIC COLUMN GRID ARRAY (CCGA)

Authors: Andrea Lawrence
Company: Celestica
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: One of the major benefits of using either BGA or CCGA modules is that standard surface mount technology equipment can be used to assembly the modules to the board and no additional costly equipment is required. Since CCGA modules are an extension of BGA modules it is logically assumed that the process steps to assemble the CCGA modules are identical to that of the BGA modules. It is possible to assemble the CCGA modules using the BGA assembly process parameters, but to achieve a low defect or defect free process there are subtle differences between BGA and CCGA modules that need to be taken into account and slight changes to process parameters are required. A process comparison of BGA and CCGA in the areas of assembly, inspection strategy, and rework will be detailed. The differences between wire and cast during all stages of high volume manufacturing and rework will be discussed. Comparative reliability results between different types of CCGA modules will be mentioned. Keywords: Column grid array, ball grid array, high volume assembly, reliability testing



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