SMTA International Conference Proceedings

Reliability Testing Of Leading Edge Components For Handheld Portable Devices

Authors: Jimmy Chow, Heather McCormick, Russell Brush, Craig Hamilton, Subramaniam Suthakaran, and Mike Berry
Company: Celestica Inc.
Date Published: 10/16/2011   Conference: SMTA International

Abstract: Handheld portable devices such as smartphones to continue to add functionality into an ever decreasing form factor. Components have had to shrink and spacings have become increasingly dense in order to enable this trend. While components such as 01005 discretes and fine pitch CSPs present obvious assembly challenges, it is also important to understand how these components perform from a reliability perspective. Handheld portable devices are exposed to a range of different conditions during use, including exposure to temperature cycles, vibration, and drops from a variety of heights. It is important to understand how components respond in these environments to ensure that a reliable assembly process has been developed. The Smartphone Test Vehicle (SPTV) included a wide range of components that would typically be found in leading edge smartphones, or will appear in next-generation models. Selected components on the test vehicle were daisy chained to allow them to be in-situ monitored during reliability testing. The test vehicle also included a bank of daisy chained 01005 live capacitors. A process for in-situ monitoring of these capacitors was developed and used during accelerated thermal cycling. The reliability test plan for the assemblies included thermal cycling, vibration testing and drop testing. Reliability results from the testing, supported by findings from failure analysis, will be presented.

Key Words: 

Reliability, CSPs, Smartphones, Thermal Cycling, Vibration

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