Surface Mount International Conference Proceedings


SOLDER PASTE DESIGN AND PERFORMANCE FOR FINE PITCH PRINTING

Author: Richard R. Lathrop Jr.
Company: Heraeus Cermalloy
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Solder paste design elements such as powder size and vehicle chemistry choices are discussed from a fictional performance viewpoint relative to fine pitch printability and solder beading in no clean formulations. KEY WORDS Solder paste printability, Solder beading



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