Packaging Technologies for OLED Displays and Lighting ProductsAuthors: Jeffrey Spindler, Vidhya Shankar Govindarajan, David Newman, and Gopalan Rajeswaran, Ph.D.
Company: Moser Baer Technologies, Inc.
Date Published: 10/16/2011 Conference: SMTA International
LEDs are intense point sources of light, where a high amount of current is driven through a small area device typically around 1mm2. With this high current density, usually in the hundreds of milliamperes per square centimeter, comes extreme heating, which must be dissipated properly in order to keep the critical internal junction temperature of the LED package low enough to maintain long term reliability. Thermal management is therefore a key system consideration when designing an LED luminaire, which consists of the LED die assembled into a package, along with optics, drive electronics, and heat sink technology. Unlike their inorganic cousins, OLEDs are flat, large-area, diffuse sources of light and can be operated at a much lower current density. Typical OLED SSL panels are 50-200 cm2 in area, and can be driven at current densities below 10 mA/cm2, thereby keeping heating effects to a minimum. As the name implies, OLEDs are constructed of carbon-containing organic layers which are sensitive to oxygen and moisture, and thus have stringent requirements around encapsulating and packaging the device to protect it from the damaging environment. The encapsulation technology used to protect the packaged OLED panel is similar for both display and SSL applications. However, the driving methods, assembly, and interconnect technologies have different requirements for each application, and therefore different solutions have been realized.
This paper discusses the latest trends in OLED technology and provides insight into the challenges and opportunities that are encountered as OLEDs are manufactured and assembled into display and SSL products.
OLED, displays, solid-state lighting, lifetime, encapsulation
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