SMTA International Conference Proceedings


Low Voiding Reliable Solder Interconnects For LED Packages On Metal Core PCBs

Authors: Ellen Tormey, Ph.D., Rahul Raut, Westin Bent, Ranjit Pandher, Ph.D., Bawa Singh, Ph.D., Ravi Bhatkal, Ph.D., and Justin Kolbe
Company: Cookson Electronics and The Bergquist Company
Date Published: 10/16/2011   Conference: SMTA International


Abstract: SSL Assemblies need to meet high reliability requirements such as Energy Star Category A which dictates a B50/L70 lifetime of 35,000 hours for commercial and outdoor residential lighting. Solder joints with low void content are critical for long term performance and reliability. Two types of MCPCB substrates, 4 different solder pastes and one type of LED ceramic package were evaluated in this study to develop a low voiding assembly process. Results of the study and recommendations for achieving low voiding are presented.

Key Words: 

LED package, MCPCB, solder joint voids



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