Embedding Components: Design And Process Implimentation PrinciplesAuthor: Vern Solberg
Date Published: 10/16/2011 Conference: SMTA International
This paper will include recommendations for PCB base material selection, design guidelines for embedding components and how to use micro-via build-up termination methodology for interconnecting both passive and active semiconductor elements. Examples will be furnished to help the product designer and manufacturing specialist in selecting component candidates for embedding and the methodologies typically adopted for developing the embedded circuit board (ECB) structure.
embedded components, printed circuit, multilayer, high density.
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