SMTA International Conference Proceedings

Embedding Components: Design And Process Implimentation Principles

Author: Vern Solberg
Company: STC-Madison
Date Published: 10/16/2011   Conference: SMTA International

Abstract: Embedded component technology is emerging as one of the more practical solutions for achieving product miniaturization. By reducing the component population on the PCB’s outer surfaces, the substrate can be made smaller. The smaller circuit board, even when complex, will often result in lower overall unit cost. Although size and cost reductions are significant attributes, embedding components can also contribute to improving functional performance. When signal rise times decrease and frequencies increase, the lead-inductance associated with interconnecting discrete surface mount components begins to degrade overall circuit function. Moving key components from the outer surface of the PCB into the substrate layers reduces both lead-inductance and parasitic capacitance. In digital circuits, for example, clock rates and signal rise time improves. In analog circuits, both bandwidth and signal rise times improve.

This paper will include recommendations for PCB base material selection, design guidelines for embedding components and how to use micro-via build-up termination methodology for interconnecting both passive and active semiconductor elements. Examples will be furnished to help the product designer and manufacturing specialist in selecting component candidates for embedding and the methodologies typically adopted for developing the embedded circuit board (ECB) structure.

Key Words: 

embedded components, printed circuit, multilayer, high density.

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