SMT Process Characterization For Package On Package Interposer (POPI)Authors: Dudi Amir and Satyajit Walwadkar
Company: Intel Corporation
Date Published: 10/16/2011 Conference: SMTA International
In a standard PoP process, a top memory package is placed on a bottom logic package. The focus of this paper is a PoP Interposer (PoPi) package where a package is placed on an interposer. Although the SMT process is similar, the additional interposer interface introduces new challenges during the assembly process.
This paper will describe the process characterization for successful assembly of PoPi on a board. It will also provide a process envelope addressing paste printing, part placement, flux dipping and reflow. Finally, it will also discuss common failures during SMT, how to identify them and eliminate them.
POPI, Package on Package, Interposer, flux dipping, process envelope
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