Surface Mount International Conference Proceedings


Author: Joachim Kloeser
Company: Fraunhofer Institute
Date Published: 4/28/1997   Conference: Surface Mount International

Abstract: The Fraunhofer Institute (FhG/IZM-Berlin) together with several industrial partners has set up a demonstration center for the assembly of flip chips (FC) and chip size packages (CSP). It consists of a complete production line, and additional equipment for quality control and process development. In the center of interest is the implementation of cost effective, high reliability and environmentally friendly processes. To achieve these goals upscaling existing flip chip technologies horn laboratory examples to industrial production is necessary. At the same time the technologies will be optimized to guarantee high quality standard and good yield at high volume production. In order to demonstrate the high performance of cost effective flip chip technologies the process flows of different flip chip assembly techniques using solder will be compared and described in detail. It is important to note that flip chip and CSPS can be used in conjunction with standard surface mount technology (SMT) devices. Finally the reliability results of a selected flip chip process are presented.

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