Surface Mount International Conference Proceedings


FLIP CHIP BONDING ON PRINTED CIRCUIT BOARD USING ANISOTROPICALLY CONDUCTIVE ADHESIVE FILM

Author: Kyoung H. Kim
Company: Samsung Electronics
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: Electronic packaging is becoming a vital part of the electronic industry, and representing a key barrier to cost reduction and performance improvement. Among the packaging methods, flip chip technology offers the highest packaging density and best electrical performance. In our study, a systematic experiment on flip-chip bonding assembly using an anisotropically conductive adhesive film (ACF) has been carried out. The assembled modules have been characterized by a number of environmental tests (Preconditioning test-SEC level II & III, temperature cycling and pressure cooker test etc.). Conduction failure mechanisms have been investigated. The results indicate that under optimum process conditions, high quality and high reliability joints can be achieved. Future research work directions in flip-chip bonding using an anisotropically conductive adhesive film on PCB (printed circuit board) will also be discussed.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819