FLIP CHIP BONDING ON PRINTED CIRCUIT BOARD USING ANISOTROPICALLY CONDUCTIVE ADHESIVE FILM
Author: Kyoung H. Kim Company: Samsung Electronics Date Published: 4/28/1997
Surface Mount International
Abstract: Electronic packaging is becoming a vital part of the electronic industry, and representing a key barrier to cost reduction and performance improvement. Among the packaging methods, flip chip technology offers the highest packaging density and best electrical performance. In our study, a systematic experiment on flip-chip bonding assembly using an anisotropically conductive adhesive film (ACF) has been carried out. The assembled modules have been characterized by a number of environmental tests (Preconditioning test-SEC level II & III, temperature cycling and pressure cooker test etc.). Conduction failure mechanisms have been investigated. The results indicate that under optimum process conditions, high quality and high reliability joints can be achieved. Future research work directions in flip-chip bonding using an anisotropically conductive adhesive film on PCB (printed circuit board) will also be discussed.