LATEST TECHNIQUES IN STENCIL PRINTING FOR HETEROGENEOUS ASSEMBLY
Authors: Mark Whitmore and Clive Ashmore Company: DEK Printing Machines Ltd Date Published: 5/19/2011
Abstract: A new (broadband) printing technique has been developed which will allow next generation ultra fine pitch components (0.3mm pitch CSP’s, 01005’s) to be printed alongside standard SMT components with a single thickness stencil and a traditional stencil printing approach. Results indicate that today’s accepted stencil area ratio rules which govern solder paste transfer efficiency can be significantly pushed out to extend stencil printing process capabilities to stencil apertures having area ratios as low as 0.4. Such a breakthrough will allow heterogeneous assembly with up and coming mixed technology requirements. Key words: Heterogeneous assembly, broadband printing, stencil printing, 0.3mm pitch CSP’s, paste transfer efficiency, area ratio.