Surface Mount International Conference Proceedings


SURFACE LAMINAR CIRCUIT1 PRINTED WIRING BOARD AND DIRECT CHIP ATTACH - FLIP CHIP

Author: Miguel Jimarez
Company: IBM Microelectronics Division
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: IBM has been doing Direct Chip Attach-Flip Chip (FC) C4 for over 30 years. During the 80’s the company developed Surface Laaminar Circuit (TM) (SLC) for Printed Wiring Boards (PWB’S). By coupling the two technologies, the company has been packaging IC’S on laminate substrates. Previously, only ceramic substrates were used to package IC’S. In this article, we discuss the history of SLC PWB’S, key features - photovias and buildup layer processing. Design options and specifically designs for area array components like FC, Ball Grid Array (13GA),Column Grid Array (CGA) and Chip Scale Packages (CSP) will also be discussed. The assembly of SLC PWB’S using FC, BGA and CGA components will be shown. Reliability data for this technology and current products and test vehicles utilizing this technology will be presented. Key words: Flip Chip, Surface Laminar Circuit, Integrated Circuit, Ball Grid Array, microvia, SLC, photovia



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