Surface Mount International Conference Proceedings


STRENGTH AND LIFETIME ANALYSIS OF SMT SOLDER JOINTS: AN EXEMPLARY STUDY OF THE MINIMELF COMPONENT

Author: J. Jendrny
Company: Universitat-Gesamthochschule
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: The reliability and lifetime of SMT solder joints obtained by reflow or wave soldering are investigated for the case of an electronic miniature resistor. Life-limiting issues addressed in this paper include irreversible deformation due to plasticity and creep, faulty positioning of the micro-electronic component, and a discussion of the influence of processing techniques (reflow vs. wave soldering), The study decisively relies on a three-dimensional, non-linear finite element (FE) analysis, the results of which are used as input to various damage models. The analytical pre-diction of lifetime is finally compared with experiments in order to prepare its transfer to real in-field situations.



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