Symposium Conference Proceedings


Authors: Mike Bixenman, DBA
Company: Kyzen Corporation
Date Published: 5/19/2011   Conference: Symposium

Abstract: The distances between conductors, and the under clearance gaps from the board to the bottom of the components on printed circuit boards, are smaller due to miniaturization. Smaller spacing increases the probability that flux residues or surface contamination will be sufficient to bridge all or most of the under clearance gap between conductors. Flux bridging conductors opens the pathway to form a conductive cell between two points on the board assembly. As a result, higher density board designs increase reliability risks, which are commonly mitigated by cleaning all flux residues and ionic contamination on the surface and under components on the assembly. One of the problems is that the low spacing under components requires increased wash time and pressure for the cleaning agent to penetrate and remove all flux residues under component gaps. The purpose of this research is to study cleaning process factors and levels as a function of the gap height. Key words: Cleaning, Defluxing, Electrical Chemical Migration, Leadless Components, Miniaturization

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819