Surface Mount International Conference Proceedings


NEW LEAD-FREE SOLDERS FOR ELECTRONICS PACKAGING AND ASSEMBLY

Author: Jennie S. Hwang
Company: H-Technologies Group
Date Published: 4/28/1997   Conference: Surface Mount International


Abstract: This paper presents several most recently developed lead-free solder alloys, which have a melting temperature comparable to that of 63Sn-37Pb (wt. Yo)alloys and exhibit nearly eutectic behavior. These characteristics distinguish these new alloys from the known and prior art alloys. Their tensile, creep, and isothermal fatigue properties were found to significantly exceed those of eutectic tin-lead alloys. Keywords: solders alloys, strength, creep, fatigue



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