Influence Of Filler Modifications On The Performance Of A Novel Anisotropic Conductive Adhesive Under Temperature/Humidity AgingAuthors: S. Manian Ramkumar, Ph.D., Alex Chen, P.E., Hari Venugopalan, Ph.D. and Kumar Khanna, Ph.D.
Company: Rochester Institute of Technology, Celestica Inc., and SunRay Scientific
Date Published: 5/4/2011 Conference: ICSR (Soldering and Reliability)
In this study, the novel ACA’s performance under highly accelerated stress testing (HAST), temperature humidity, and thermal aging will be discussed in detail. The test data will show that by modifying the ACA filler particle size and filler particle coating, the reliability performance under temperature-humidity aging can be positively impacted. In addition, the data will also show that thermal aging actually improves the contact resistance performance. Furthermore, the contact resistance performance of the different adhesive formulations will also be corroborated with shear testing.
Key words: Anisotropic Conductive Adhesive, Lead-free Assembly, Temperature-Humidity Aging, ZTACH™, Selfassembly
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