Conductive Crystals, White Residues and Decreased Reliability - The Rush To Clean No-CleanAuthor: Michael Konrad
Company: Aqueous Technologies Corporation
Date Published: 5/4/2011 Conference: ICSR (Soldering and Reliability)
Once commonplace, then relegated to military and other high reliability applications, today, defluxing has once again moved toward the mainstream. The miniaturization of electronic assemblies and their components, implementation of lead-free alloys, combined with improved quality standards and higher reliability expectations have culminated to form a growing demand for ionicly clean electronic circuits.
This paper will review the major causes of residue-related failures including dendritic growth, electrical leakage, and under-coating adhesion failures. Why we clean and what we are removing, and how clean is clean will be presented. Key words: Cleaning, Cleanliness, Defluxing, Electro- Migration, Electrical Leakage, Cleanliness Testing
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