ICSR (Soldering and Reliability) Conference Proceedings


Optimization of the 01005 Discrete Assembly Process

Author: Mike Berry
Company: Celestica Inc.
Date Published: 5/4/2011   Conference: ICSR (Soldering and Reliability)


Abstract: In order to ensure high assembly yields for products incorporating 01005 discrete components, it is necessary to optimize the pad design and screening process. These new components are extremely challenging to incorporate into the manufacturing process, as their size drives the need for very small stencil apertures that generally require violating typical recommendations for area aspect ratios. In order to achieve high yields, many factors must be optimized. This paper summarizes the approach taken to study 01005s focusing on factors such as pad size, shape and definition method, particle size for solder paste and stencil design, and presents findings critical to the development of the 01005 assembly process.

Key words: 01005, Process, Screening, Stencils, Area Ratio, Dust, Board Design



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