ICSR (Soldering and Reliability) Conference Proceedings

How Using Automated 3D X-Ray Inspection Can Improve Product Reliability

Authors: Barbara Koczera and An Qi Zhao
Company: Test Research USA, Inc. and Flextronics International Inc.
Date Published: 5/4/2011   Conference: ICSR (Soldering and Reliability)

Abstract: As the Consumer Electronics Manufacturing Industry continuous to move towards the miniaturization of Printed Circuit Board Assemblies(PCBAs), the use of components such as Package-on-Package (POP), Pack-in-Package (PIP), and components with hidden joints such as Quad Flatpack No-Lead (QFNs) and Field-Effect-Transistors (FETs) is increasing. With this change, more companies are finding it necessary to incorporate Automated 3D X-Ray Inspection (AXI) into their Production Process in order to maintain product quality and reliability. Hidden joints can be especially dangerous to product reliability as “marginal” solder joints pass In-Circuit Test (ICT) and Functional Test (FCT) however, often fail in the field -- resulting in increases in warranty costs and decreases in Customer satisfaction. This presentation will focus on how 3D AXI can be used to detect Marginal Joints and other solder related defects, such as Voiding or Cold Solder joints on high temperature Thermal Pads and other hidden joints devices that are undetectable by other test methods. Left undetected, these defects can severely impact product reliability.

Key words: AXI, QFN, FET, Heat Transfer, Void

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