Microstructure and Whisker Growth of SAC Solder Alloys with Rare Earth Additions in Different EnvironmentsAuthors: Doug Perovic, Leonid Snugovsky, John Rutter, Polina Snugovsky, Zohreh Bagheri, and Stephan Meschter
Company: U of T, Celestica Inc., and BAE Systems
Date Published: 5/4/2011 Conference: ICSR (Soldering and Reliability)
The whisker growth phenomenon is studied on solder joints including samples previously cross-sectioned. The samples were exposed to different environments including: open air at ambient temperature, nitrogen atmosphere at ambient temperature, and high temperature/high humidity and checked periodically for whisker evolution. It was found that whisker formation depends on microstructure and may grow in all conditions including nitrogen atmospheres. The whisker length, density, relationship with microstructure and mitigation measures are discussed in this paper. Key words: Tin Whiskers, Lead Free, Rare Earth Elements
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