ICSR (Soldering and Reliability) Conference Proceedings

Whisker-Impenetrable Metal Cap Process For Electronic Assemblies

Authors: Robert J. Landman, Gordon Davy, Dennis D.Fritz
Company: LDF Coatings LLC
Date Published: 5/4/2011   Conference: ICSR (Soldering and Reliability)

Abstract: A process is described for depositing a nickel (or other whisker-impenetrable metal) cap over all lead-free tin and high-percentage tin alloys, but not on any insulating sufaces (component bodies, solder mask, etc.) of an electronic asembly. Reasons are given for expecting that this cap layer will prevent the growth of tin whiskers permanently. The process is contrasted with other whisker prevention aproaches and with earlier, so-called "mitigation," meaures available to electronics OEMs that at best reduce whisker growth risk.

Keywords: tin whisker, mitigation, nickel cap, electroless plating,

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819