ICSR (Soldering and Reliability) Conference Proceedings


Whisker-Impenetrable Metal Cap Process For Electronic Assemblies

Authors: Robert J. Landman, Gordon Davy, Dennis D.Fritz
Company: LDF Coatings LLC
Date Published: 5/4/2011   Conference: ICSR (Soldering and Reliability)


Abstract: A process is described for depositing a nickel (or other whisker-impenetrable metal) cap over all lead-free tin and high-percentage tin alloys, but not on any insulating sufaces (component bodies, solder mask, etc.) of an electronic asembly. Reasons are given for expecting that this cap layer will prevent the growth of tin whiskers permanently. The process is contrasted with other whisker prevention aproaches and with earlier, so-called "mitigation," meaures available to electronics OEMs that at best reduce whisker growth risk.

Keywords: tin whisker, mitigation, nickel cap, electroless plating,



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