ICSR (Soldering and Reliability) Conference Proceedings

Studies In The Interaction Of Moisture And PCBs, Part 2

Authors: B. Christian, Brandon Smith, Jordan Lui and Gyubok Baik
Company: Research In Motion
Date Published: 5/4/2011   Conference: ICSR (Soldering and Reliability)

Seika Machinery, Inc.

Abstract: Three halogen-free board materials were examined for their ability to adsorb/absorb water vapor. The results of the study show that at room temperatures likely to be experienced in any electronics manufacturing facility worldwide, the key to the amount of water taken up by the boards is determined by the length of exposure and the relative humidity. Interestingly, temperature apparently plays an inconsequential role. A predictive equation for moisture uptake for one material is proposed.

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