Pan Pacific Symposium Conference Proceedings


Emerging Embedded Devices Into Substrate For More Than Moore Era

Author: Henry Hisanobu Utsunomiya
Company: Interconnection Technologies, Inc.
Date Published: 1/18/2011   Conference: Pan Pacific Symposium


Abstract: 3D integration is substantial technology to improve electrical performance, solder joint reliability, EMI together with shorten time-to-market, smaller form factor and reduce total cost of system and/or subsystem. The devices embedded into packaging substrate and/or organic printed circuit board is economical solution for 3D integration due to utilized conventional PCB process and SMT, however it is not well known by designers of OEM. The institutes, OEMs and PWB manufacturer has been demonstrating strength of embedded active devices and passive devices into PWB more than 10 years. As the results of these efforts, EAD and EPD are adopts to several applications such as the camera modules, the TV tuner modules, the power supply modules for cellular phone. And it is expected to expanding applications form consumer mobile electronics to automotive, industrial, medical devices. Moreover, it is an essential technology to propagate wearable devices for health care applications. Business model of EAD/EPD, reliability studies, case studies and technology roadmap were addressed in this paper. Key words: 3D integration, EAD: embedded active devices, EPD: embedded passive devices



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