Low-Cost Silicon And Glass Interposers And PackagesAuthors: Professor Rao R. Tummala; Venky Sundaram, Ph.D.; Tapobrata Bandyopadhyay; Vivek Sridaran; and Vijay Sukumaran
Company: Packaging Research Center, Georgia Institute of Technology
Date Published: 1/18/2011 Conference: Pan Pacific Symposium
This paper describes the glass and silicon interposers from electrical design and modeling, to tools, materials and processes to fabricate interposer and integrate such interposers with selective embedded thin film passive components.
Key words: Silicon, glass, interposers, miniaturization, 3D integration, embedded components, design, modeling, through-package-vias.
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