Pan Pacific Symposium Conference Proceedings


Integration Of Magnetics, Semiconductors, And PCBs In One Component

Authors: Tamim P. Sidiki, Ph.D., Abel Pot, Frank van der Burgt, See-Wee Ong, Rinus v. d. Berg, and Horst Roehm, Ph.D.
Company: DSM Engineering Plastics and NXP Semiconductors
Date Published: 1/18/2011   Conference: Pan Pacific Symposium


Abstract: The continuous trend towards convergence and miniaturization is recently generating significant interest in new technologies for Electronics. This requires the integration of Semiconductors and Magnetics, two entirely different industries with different players in the value chain. In this paper, we demonstrate, a packaging technology which allows three dimensional stacking of Magnets and Semiconductors. We realized the integration of a Semiconductor chip - which provides protection against electro static discharge (ESD) – and a common mode filter (CMF) into one thermoplastic package. For the first time ever, this filter is integrated directly into the thermoplastic part which is used as the substrate, filter and housing at the same time.



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