Pan Pacific Symposium Conference Proceedings

Developments In Nano Enabled Interconnects

Author: Alan Rae
Company: TPF Enterprises LLC
Date Published: 1/18/2011   Conference: Pan Pacific Symposium

Abstract: Nanotechnology is a way of rendering surfaces and interconnect materials more active. As such it can be applied to surface finishes and interconnect materials to enable connections at lower temperatures with tailored properties. This paper reviews materials reaching the market and outlines the steps necessary for them to be fully accepted by the industry.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819