Pan Pacific Symposium Conference Proceedings


Developments In Nano Enabled Interconnects

Author: Alan Rae
Company: TPF Enterprises LLC
Date Published: 1/18/2011   Conference: Pan Pacific Symposium


Abstract: Nanotechnology is a way of rendering surfaces and interconnect materials more active. As such it can be applied to surface finishes and interconnect materials to enable connections at lower temperatures with tailored properties. This paper reviews materials reaching the market and outlines the steps necessary for them to be fully accepted by the industry.



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