Authors: Horatio Quinones, Tom Ratledge, and Heakyoung Park Company: Nordson Asymtek Date Published: 1/18/2011
Pan Pacific Symposium
Abstract: High brightness Light Emitting Diode packaging, while relatively young compared to traditional microelectronics packaging, is on a fast track to become a mature and well-established discipline. Though both types of packages share multiple processes, manufacturing HB-LED packages poses multiple new challenges. New materials and constantly advancing acceptance criteria for the performance of both blue and UV diodes mandate innovative approaches that test the limits of manufacturing equipment and engineering. Newer processes using nano-dispensing and/or discretized fluid deposition are required to achieve the required process quality, yield and throughput. This paper shares fluid dispensing techniques that can meet HB-LED manufacturing challenges and supporting data, as well as (spell this out) CIE encapsulation process dependencies. A proven manufacturing non-contact dispense system/process is described at depth. At a wafer level, HB-LED phosphors coating seems to be a very attractive process from both UPH and optical advantages. Here we propose alternate processes for achieving reliable coating using various dispensing techniques.