NEW DEVELOPMENTS IN BROADBAND PRINTING TECHNIQUESAuthors: Mark Whitmore, Clive Ashmore
Company: DEK Printing Machines Ltd.
Date Published: 10/24/2010 Conference: SMTA International
Results indicate that today’s accepted stencil area ratio rules which govern solder paste transfer efficiency can be significantly pushed out to extend stencil printing process capabilities to stencil apertures having area ratios as low as 0.4. Such a breakthrough will allow heterogeneous assembly with up and coming mixed technology requirements.
Key words: Heterogeneous assembly, broadband printing, stencil printing, 0.3mm pitch CSP’s, paste transfer efficiency, area ratio.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.