CLEAN “NO-CLEAN” OR USE A WATER WASH SOLDER PASTE?Authors: Gerjan Diepstraten; Tim Lawrence, Ph.D.
Company: Cobar Europe B.V.; Cobar/Balver Zinn
Date Published: 10/24/2010 Conference: SMTA International
For customers requiring the extra confidence that cleaning brings, the option of water wash has remained, with many products available. This approach allows the use of highly activated materials ideal for components with poor solderability and/or high thermal demand with no risk of failure in service.
The clear demarcation between these two strategies has blurred slightly over recent years, with some manufacturers seeking to combine the convenience of no-clean fluxing with the confidence of water wash by cleaning no-clean flux residue.
This paper assesses the wisdom of such an approach.
Key words: Solder paste, cleaning.
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