SMTA International Conference Proceedings


Authors: Gerjan Diepstraten; Tim Lawrence, Ph.D.
Company: Cobar Europe B.V.; Cobar/Balver Zinn
Date Published: 10/24/2010   Conference: SMTA International

Abstract: Since the demise of CFCs as a cleaning option in the 1970s (1), no-clean fluxing technology has become increasingly popular in electronics assembly (2). The benefits include a reduced number of process steps, simpler qualification with no need to specify cleaning detail, and reduced cost.

For customers requiring the extra confidence that cleaning brings, the option of water wash has remained, with many products available. This approach allows the use of highly activated materials ideal for components with poor solderability and/or high thermal demand with no risk of failure in service.

The clear demarcation between these two strategies has blurred slightly over recent years, with some manufacturers seeking to combine the convenience of no-clean fluxing with the confidence of water wash by cleaning no-clean flux residue.

This paper assesses the wisdom of such an approach.

Key words: Solder paste, cleaning.

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